| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive low-profile high frequency module having a high-frequency amplifier, which includes a substrate and a semiconductor chip, and an irreversible element such as an isolator. SOLUTION: In a high-frequency module, a high-frequency amplifier 3 is arranged next to, electrically connected to, and physically fixed to an irreversible element 4. The high-frequency amplifier 3 and the irreversible element 4 are covered with a metal cap 13. Since the irreversible element 4 having a large height is not placed on a substrate 5, this module becomes a low-profile one and the substrate does not need a space for a hole in which the irreversible element 4 is mounted. |
