| 摘要 |
PROBLEM TO BE SOLVED: To enable sure formation of a semiconductor device, such as SON-type device of resin without producing resin burrs. SOLUTION: In this method of resin-sealing of a semiconductor device, on which a lead 14 connected electrically to electrodes of a semiconductor chip 12 is exposed along the outer surface of the sealing resin which seals the semiconductor chip 12, in such a way that surface-mounting is made possible, the formed product in which one end of the lead 14 is bonded to the chip surface of the semiconductor chip 12 is clamped by molds 40 and 42, by pressing a release film 32 against the exposed surface of the lead 14, and the cavity is filled with resin for resin sealing.
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