发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To relax stresses of a film-covering metal wirings to metal wirings and reduce the inter-line capacitance between the wirings. SOLUTION: By using an SiON film is used as a film (inter-layer insulation film/passivation film) covering metal wirings 10, 20 formed on memory cells composed of floating gates 4, control gates 6, etc. This is intended to reduce the inter-line capacitance between the wirings and reduces the stresses exerted on the metal wirings 10, 20, to thereby suppress the form deterioration of the metal wirings 10, 20.
申请公布号 JP2001144176(A) 申请公布日期 2001.05.25
申请号 JP19990322859 申请日期 1999.11.12
申请人 SANYO ELECTRIC CO LTD 发明人 NOMA TAKASHI;HARA SEIJI;SAITO KIMIHIDE;KAWAI AKIRA;SHIKANUMA YOICHI;OKADA KAZUHISA
分类号 H01L21/8247;H01L21/318;H01L21/768;H01L23/522;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/768;H01L21/824 主分类号 H01L21/8247
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