CHIP TYPE SOLID ELECTROLYTIC CAPACITOR AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To relatively improve volumetric efficiency of a capacitor element by miniaturizing resin encapsulation body. SOLUTION: Almost U-shaped components having no bent point other than base parts 32 and 42 are used for an anode terminal plate 30 welded to an anode lead 111 of a capacitor element 10 and a cathode terminal plate 40 fitted to a bottom surface 114 of the element with a conductive bonding material. Further, each of base parts 32 and 42 of the terminal plate is put in the same plane with a bottom surface 21 of the resin encapsulated body 20.