| 摘要 |
<p>A package substrate suitable for use with a ball grid array according to the invention includes an electrically and thermally conductive heat sink (100) having a top surface (117) and a bottom surface (116), the heat sink having a slot (110) formed therethrough which opens onto the top and bottom surfaces. A dielectric layer (102) is formed on the bottom surface of the heat sink proximate the slot, preferably directly thereon without an intervening adhesive layer. A circuit (105) is selectively formed in a circuit pattern on the dielectric layer. An electrically resistive soldermask (108) is disposed on the dielectric layer and the circuit, which soldermask has opening therethrough which expose bond pads (106) of the circuit. Such a substrate according to the invention permits the integrated circuit die to be mounted over the slot in the manner of a lead-on-chip package, but provides bond pads to which solder balls (107) can be mounted in order to form a ball grid array.</p> |
