发明名称 HEAT CHARACTERISTIC SIMULATION ELEMENT FOR SEMICONDUCTOR ELEMENT AND MEASURING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To accurately and easily evaluate the heat characteristics such as heat capacity or the like of electronic machinery loaded with a semiconductor element. SOLUTION: A heater 2 comprising a Pt membrane is formed on the flat surface 6 of a sustrate 1 comprising a sintered material based on aluminum nitride, and a temperature sensor comprising the Pt membrane is also formed on the flat surface 6 of the substrate 1. The heater 2 is operated by predetermined power to generate heat and the temperature at this time is detected by the temperature sensor 3. On the basis of the supply power of the heater 2, that is, heat value and the detection temperature of the temperature sensor 3, the heat conductivity, heat capacity and other heat characteristics of an object to be measured being electronic machinery are measured. By this constitution, the heat planning of electronic machinery loaded with a new semiconductor element can be performed accurately and easily.
申请公布号 JP2001141680(A) 申请公布日期 2001.05.25
申请号 JP19990320172 申请日期 1999.11.10
申请人 KYOCERA CORP;SONY CORP 发明人 INOUE TOMOKI;IDE NAOHITO;OTSUKA YASUSHI;TANAKA NOBUYUKI
分类号 H01L21/00;G01N25/18;(IPC1-7):G01N25/18 主分类号 H01L21/00
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