PACKAGING METHOD OF WORK WITH BUMP AND PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a packaging method and structure of work with a bump for reducing the packaging area of the work with a bump for high-density packaging when packaging the work with a bump such as a flip chip to other works such as a printed-circuit board with an adhesive by bonding, guarding the upper surface corner part of the work with a bump, and preventing the work with a bump from being lifted due to such stress as a heat cycle. SOLUTION: An adhesive 7 being applied to a printed-circuit board 1 is allowed to creep up along the side surface of a flip chip 3, and the upper end part 7' is allowed to project upward from the upper surface of the flip chip 3 so that it is tilted forward to the side of the flip chip 3.