| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus which do not use slurry as a polishing agent. SOLUTION: A polishing apparatus has a polishing plate 13 which has a rotary shaft 18 and is covered with a polishing cloth 14, a carrier 15 which is placed so as to face the polishing cloth 14 and can bring a substrate 16 to be polished into contact with the polishing cloth 14, and a polishing agent supply means 17 which forms a gas in which polishing particles are dispersed and supplies the gas to the surface of the polishing cloth 14. That is, the gas in which the particles are dispersed is used as a polishing agent instead of slurry which is conventionally used and supplied between the substrate 16 and the polishing cloth 14 to contribute to polishing. With this constitution, equipment for waste fluid is not necessary at all, so that an equipment cost can be reduced significantly. |
