| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for optical semiconductor elements, where its high airtightness is held, and its head radiation quality is superior, and further miniaturization is made possible. SOLUTION: A package 3 for optical semiconductor elements has as its main constituent members a metal bottom plate 1 for mounting thereon an optical semiconductor element and has a metal frame 4 jointed to the surface of the metal bottom plate 1 and having a window frame 5 for holding an optical fiber therein. In the package 3, a plate 2 having an anisotropic high thermal conductivity whose value in its planar direction is not smaller than 250 W/m.K is jointed to the required place of the surrounded surface portion of the package 3 by the metal frame 4. Since the heat radiation quality of the metal bottom plate 1 is improved by the plate 2, having anisotropic high thermal conductivity (a graphite-fiber composite plate, etc.), jointed to its surface, it can be so thinned within the range of its airtightness which is held and its deformation being prevented to enable miniaturization of the package 3 for optical semiconductor elements.
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