| 摘要 |
PROBLEM TO BE SOLVED: To heat a sealing part to sealing temperature for securing sealing quality, even if a package comes into contact unevenly with a pulse heat tool, due to the package-finishing accuracy of a lid and a package in package solder sealing by the pulse heat, where heating influence to an element in the package, or the like is small. SOLUTION: A lid is placed on the heater of a pulse heat tool, while the surface faces down for placing in the lid while the bottom surface of a ceramic package body faces up. While the bottom surface of the package is being pressurized by a nozzle, where a temperature-sensing means is mounted at a tip, a preset pulse current is supplied from a pulse heat device to the heater. The temperature of the bottom surface of the package is measured by the output of the temperature-sensing means which is mounted at the tip of the nozzle, and confirmation of heating up required for sealing, where experiment has been made in advance is obtained.
|
