| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent malfunctions of an integrated circuit formed on a semiconductor wafer and the measurement errors of a test output signal, in a wafer prober superior on durable characteristic, by improving the adhesive property of an inspection stage and a terminal pin. SOLUTION: A chuck top conductor layer 14 is installed on the surface of an inspection stage 12, on which a semiconductor wafer is placed. Through- holes 26 and 28, which electrically connect electrodes 22 and 24 installed inside to outer terminals 36, are formed inside the inspection stage 12. Through-hole protective layers 32 formed of nickel are installed at the end faces of the through-holes 26 and 28 through sputtering. The outer terminal pins 36 are fitted on the protection layers 32 via wax materials 34.
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