| 摘要 |
PROBLEM TO BE SOLVED: To enable confirmation of electrical contact of solder balls to be performed when a device is mounted. SOLUTION: This contact film 30 comes into electrically contact with the ball grid array device having the plural solder balls as external terminals arranged in a grid state. The contact film 30 has a first insulative elastic film (310, 320, 330) including plural contacting opening parts 311 formed in positions corresponding to the solder balls and first contact patters 312 around the opening parts 311 coming into first contact with the solder balls; and a second insulative elastic film 340 laminated on the first insulative elastic film (310, 320, 330), including second contact patterns 341 coming into second contact with the solder balls through the opening parts 311 in positions corresponding to the opening parts 311. The electrical contact of the solder balls can be confirmed on the basis of the presence of conduction between the first and second contact patterns 312, 341. |
