| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device, which is almost free of a mounting failure when an LED die is mounted and a method of forming the same. SOLUTION: An optical semiconductor device is equipped with a package 1 composed of a positive and a negative lead electrode, 2 and 3, and a molded resin 10 and an optical semiconductor die 4 provided with a positive and a negative die electrode, 5 and 6, formed on its main surface, where the semiconductor die 4 is mounted on the lead electrodes 2 and 3 through the intermediary of conductive adhesive members 7 and 8 in a flip-chip mounting manner. The package 1 is provided with a recess 9 between the lead electrodes 2 and 3, and at least the recess 9 is provided at a position making its part face the semiconductor die 4. |
