| 摘要 |
PROBLEM TO BE SOLVED: To obtain a noncontact-type IC card having high surface smoothness, high reliability in electric connection structure and easily connecting wires on a wiring crossing part. SOLUTION: This noncontact-type IC card 1 has structure forming a coil conductor 3 on a substrate, mounting an IC chip 4, connecting the inside end of the conductor 3 to the 1st connection terminal 4a of the chip 4, electrically connecting the outer end of the conductor 3 to the 2nd connection terminal 4b of the chip 4 via an electrode land 4c by a conductive tape 6, and partially forming a photo-curing pressure sensitive adhesive layer 6b containing a pressure-sensitive adhesive polymer, an optical cationic polymer compound and an optical cationic polymerization starting agent on one surface of a conductive base material 6a as the conductive tape 6. |
