| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem such that it is extremely difficult to solder a variety of electronic parts by uniformly heating the parts within a less temperature margin of approximately 20-30 deg.C since the melt point of lead-free solder is approximately 210-220 deg.C and the heat-resistance temperature of electronic parts for reflow soldering is approximately 240 deg.C. SOLUTION: A nozzle 9 for spraying hot air projecting in a line for speedily jetting the hot air is aligned at a specific interval opposite to a printed-wiring board 6, and a recess for exhaust and flow-back is formed between the nozzles as a blast body. A reflux path 20 of hot air is arranged, and a heater 10 is arranged at the recess for forming its one portion, and hot air and infrared rays are applied to the printed-wiring board 6 for melting solder for soldering. The heater 10 re-heats the hot air that is allowed to flow back.
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