| 摘要 |
PROBLEM TO BE SOLVED: To mount a noise eliminating filter circuit element at high density. SOLUTION: A chip layer mounting a semiconductor chip 12, a ground layer 14 and a power supply layer 16 are housed in a package 10 so as to pinch an insulation substance mutually, and inductor element mounting terminals 22, 24, and capacitor element mounting terminals 26, 28 are disposed in a chip, corresponding region 18 facing the semiconductor chip 12 out of a reverse face of the package 10, and an external connecting signal wiring terminal 30 is disposed in the region 20.
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