THICK FILM WIRING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a thick film wiring material that can properly suppress the precipitation of foreign matter within an electrode. SOLUTION: Because platinum group elements are included in a thick film silver paste and alloy is formed by the reaction with silver included in it with the platinum group element paste to disperse silver into Y electrode and X electrode and then suppress reaction with the platinum constituting them, the thick film can disperse silver into an electrode and suppress the precipitation of foreign matter in burning processing of silver paste. For this reason, it hardly generates variation of electron emission efficiency or electron emission amount from an electron emission film.