| 摘要 |
PROBLEM TO BE SOLVED: To improve efficiency in resistivity with respect to thermal fatigue even in the case of utilizing non-lead solder, and to suppress changes in resistivity of die-bonding part even if it is the die-bonding part is heated, when a semiconductor device is mounted on a printing substrate by means of solder. SOLUTION: In a manufacturing method of the semiconductor device, IC chip is die-bonded to a lead frame island by means of a solder material, and electrode connection and resin molding are performed. The solder material includes 0.005 to 5.0 wt.% ot at least either one of Fe or Ni, preferably 0.1 to 20 wt.% Ag, or 0.05 to 9 wt.% Cu, or 0.1 to 15 wt.% Ag and 0.05 to 5 wt.% Cu. Furthermore, it has 0.1 to 15 wt.% Sb and the rest of the contents is substantially Sn. The semiconductor device is heat treated at 150 to 200 deg.C after resin molding. |
