发明名称 |
MULTI-CHIP MODULE FOR USE IN HIGH-POWER APPLICATIONS |
摘要 |
A multiple semiconductor chip module for use in high-power applications includes at least a power semiconductor chip (30) and a control semiconductor chip (40) mounted on an electrically conductive heat sink (20). The power semiconductor chip may be a Silicon-On-Insulator (SOI) device and the control semiconductor chip may be a semiconductor device having a substrate connected to ground potential. The power semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics. |
申请公布号 |
WO0137336(A1) |
申请公布日期 |
2001.05.25 |
申请号 |
WO2000EP10608 |
申请日期 |
2000.10.26 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
MAJID, NAVEED;MOBERS, TON;MUKHERJEE, SATYEN |
分类号 |
H01L25/07;H01L23/14;H01L25/16;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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