| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for correcting deformation developed in a metal application base film by allowing the metal application base film that is formed by applying metal foil to one surface of a flexible insulation substrate, and is formed with the metal foil application surface side inside to a process for retaining under heating and/or a process for retaining under reduced pressure, and a method for manufacturing a printed-circuit board with such warpage elimination process. SOLUTION: According to the present invention, a metal foil application base film where warpage deformation has occurred is retained under heating or reduced pressure, thus correcting warpage deformation. Also, even if the metal foil application base film where the warpage deformation has occurred is used, an accurate printed-circuit board can be manufactured.
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