| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency module, which can effectively scatter heat generated in a semiconductor chip, mount other electronic components on a substrate over if the semiconductor chip is thinned, and increase an adhesive strength between the semiconductor chip and a heat sink. SOLUTION: A semiconductor chip 6 is fixed onto a substrate 5 in a flip-flop state. A heat sink 8, having a structure in which a part of the face on a side of the semiconductor chip 6 is projected, is fixed to a face on a side opposite to the substrate 5 of the semiconductor chip 6, by electrically connecting the face of its projection part 8a thereto. |
