| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which high flexibility in the design of wiring and high density of through hole are realized effectively and the wiring can be routed effectively in the multilayer printed wiring board. SOLUTION: At the part 2s of a core board 2 corresponding to an IC chip 9, the majority of through hole conductors 4 in a region is connected with a directly overlying via conductor 8s on the first major surface side. At the circumferential fringe part 2t other than the part corresponding to the IC, the majority of through hole conductors 4 in the region is connected with a hole edge via conductor 8t on the first major surface side. |
