发明名称 SUBSTRATE-ARRAYING METHOD, SUBSTRATE-ARRAYING EQUIPMENT AND PROCESSOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate-arraying method, substrate-arraying equipment, and small processor which enable stable formation of substrate groups in a short time. SOLUTION: An arraying method for wafers W comprises the step of extracting 26 wafer group W from among one carrier C at equal intervals L, and 26 wafers W among the other carrier C, and the step of inserting each of the 26 wafer group W extracted from among the other carrier C between the 26 wafer group W extracted from among of one carrier group C, thereby forming a wafer group 100 where 52 wafers W are arrayed at equal intervals L/2, that is approximately half the equal intervals L.</p>
申请公布号 JP2001144164(A) 申请公布日期 2001.05.25
申请号 JP19990323866 申请日期 1999.11.15
申请人 TOKYO ELECTRON LTD 发明人 TAKAGUCHI REI
分类号 H01L21/677;B65G49/07;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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