| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor of a pre-mold package form capable of improving sensitivity or repeatability, and reducing temperature dependency of offset. SOLUTION: This sensor has a glass pedestal 2 joined with a semiconductor pressure sensor chip 1, a body 3 for storing these members, a plate 10 arranged between the body and the glass pedestal and formed from glass or metal material, a lead frame 5 molded integrally with the body, and the like. The plate is bonded to the body in advance, and thereafter the glass pedestal is bonded to the plate by an adhesive made of a silicone resin having a low stress to be hardened by a platinum compound catalyst or an adhesive 4 made of an epoxy resin having a low stress, to thereby prevent the adhesive from adhering directly to the body.
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