THROUGH HOLE RESIN FILLING METHOD AND PRINTED-CIRCUIT BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a through hole resin filling method for completely filling the inside of a fine and high-density through hole being provided at a core material with resin. SOLUTION: A core material 20 where a sheet-shaped epoxy resin 51 is laminated on one surface is placed on a retention plate 607 in a vacuum chamber 601. Then, the epoxy resin 51 is heated by a compression bonding plate 609 with a heater 611, and at the same time is pressurized so that the epoxy resin 51 adheres to the core material 20. Air in T/H (not illustrated here) of the core material 20 passes through a ventilation port 605 and is sucked by a vacuum pump 603. The epoxy resin 51 is filled into the T/H.