发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To solder a substrate land of each printed circuit board, covering a plurality of printed circuit boards and surely dividing adjacent printed circuit boards after soldering, during manufacturing a printed circuit boards securely grounded(GND) which is used for a high-frequency circuit unit. SOLUTION: Land patterns 2, 3 are formed on both the right and the left sides of a printed circuit board 1. Since the land patterns 2, 3 are arranged asymmetrically to the right and the left, each of lands 2a, 3a forming land patterns 2, 3 does not come into contact with each other, covering a plurality of the printed circuit boards 1, 1. Therefore, even if the lands 2a, 3a are subjected to soldering, the lands 2a, 3a are not fixed with each other, and the printed circuit board can be divided immediately without removing solder at a joint.
申请公布号 JP2001144386(A) 申请公布日期 2001.05.25
申请号 JP19990325048 申请日期 1999.11.16
申请人 SHARP CORP 发明人 KIMURA TOKUJI
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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