发明名称 LAMINATED CERAMIC CAPACITOR FOR THREE-DIMENSIONAL MOUNTING
摘要 PROBLEM TO BE SOLVED: To provide a laminated ceramic capacitor for three-dimensional mounting which is made to be mounted suitably on electronic equipment, such as the personal computer, etc., the operating frequency of which becomes faster as a low-ESL and low-ESR capacitor by reducing the interval between external electrodes and, when the capacitor is mounted on the surface of a three- dimensional multilayered printed board, etc., can reduce the size of the equipment and the height of parts as a whole. SOLUTION: In a laminated chip base, internal electrode 1 is provided with a size not wider than that of a ceramic layer 2, and exposed portions 1a, 1b of the internal electrode 1 are structured in an alternately reverse disposition at internals of the adjoining ceramic layers 2 with its shorter side in the heightwise direction (h). External electrodes 3, 4 electrically connecting to each of the internal electrodes at the exposed portions 1a, 1b alternately disposed at reverse position are provided face to face via the ceramic layers. The external electrodes 3, 4 are respectively faced to circuit patterns of different circuit boards to constitute electrically connecting three-dimensional structure.
申请公布号 JP2001143954(A) 申请公布日期 2001.05.25
申请号 JP19990326890 申请日期 1999.11.17
申请人 TDK CORP 发明人 ABIKO TAISUKE;TOGASHI MASAAKI
分类号 H01G4/12;H01G4/228;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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