PACKAGING FOR A SEMICONDUCTOR CHIP

摘要

The invention relates to a packaging for a semiconductor chip (10). A frame (9) that directly surrounds the slot (5) is provided on the carrier board (1) on the side of the nubbins (8). Said frame is provided with the same height as the nubbins (8) and the slot (5) and the frame (9) surrounding said slot (5) are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip (10).