发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which downsizes an apparatus for adjusting the temperature and humidity of air to be fed to a resist coating unit and a developing unit and reduces the running cost such as power consumption, etc. SOLUTION: Fresh air taken from the outside is cooled by a refrigerator 61 and then flowed to a low temperature passage of a heat exchanger 62 while fresh air is flowed to a high temperature passage of the heat exchanger 62 to heat exchange the cooled air with the fresh air. The air flowing in the low temperature passage of the heat exchanger 62 is warmed by the air flowing in the high temperature passage, and then heated and humidified by a heater 63 and a humidifier 64 to feed an air at a specified temperature and a specified humidity to a resist coating unit (COT). The air flowing in the high temperature passage of the heat exchanger 62 is cooled by the air flowing in the low temperature passage and then heated by a heater 66 to feed an air at a specified temperature to a developing unit (DEV).
申请公布号 JP2001143985(A) 申请公布日期 2001.05.25
申请号 JP20000265186 申请日期 2000.09.01
申请人 TOKYO ELECTRON LTD 发明人 YANO MITSUTERU;SENBA NORIO;KANEKAWA KOZO;OI KAZUHIKO
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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