发明名称 METAL POLISHING FLUID AND POLISHING METHOD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a metal polishing fluid which can realize a high polishing speed ratio between a foundation barrier layer and an insulating layer, can realize high surface uniformity and high flatness, and can form the flush pattern of a metal film with high reliability, and to provide a polishing method using the fluid. SOLUTION: A metal polishing fluid contains metal oxidizing agent, metal oxide dissolving agent, protective film forming agent, water-soluble polymer and water, and has the ratio of the polishing speed of a metal layer to the polishing speed of a barrier layer not less than 10 and the ratio of the polishing speed of the metal layer to the polishing speed of an insulating layer not less than 100.
申请公布号 JP2001144047(A) 申请公布日期 2001.05.25
申请号 JP19990322451 申请日期 1999.11.12
申请人 HITACHI CHEM CO LTD 发明人 KURATA YASUSHI;KAMIGATA YASUO;UCHIDA TAKESHI;TERASAKI HIROKI;IGARASHI AKIKO
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
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