| 摘要 |
PROBLEM TO BE SOLVED: To obtain a surface mount electronic component provided with external electrodes having a structure in which plating films are layered on a metallic film with a wet barrel plating method, where dispersion in the thickness of the plating film in the external electrodes can be reduced, an incident rate of defective products can be suppressed and a plating film material can efficiently be used. SOLUTION: The external electrodes 3-5 are formed on an outer surface of an electronic component body 2, the external electrodes 3-5 consist of the metallic film and the plating film formed on the metallic film by the wet plating method, the areas of the external electrodes 3-5 are made nearly equal to each other and the sums of the lengths of the external electrodes 3-5 on the edges of the electronic component body are made almost identical to each other in this surface mount electronic component 1.
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