| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a metal polishing method using a metal polishing fluid which realizes a high CMP speed, can obtain high flatness, can reduce a dishing value and an erosion value, and can form the flush pattern of a metal film with high reliability. SOLUTION: In a metal polishing method, a board with a copper or copper alloy film is pressed against a polishing cloth on a polishing surface plate and, in that state, the polishing surface plate and the board are moved relatively to each other while a polishing fluid is supplied onto the polishing cloth. At least, the copper surface reaction layer of the copper film is polished with a metal polishing fluid which does not contain abrasive grains.</p> |
