Heat-dissipating structure for integrated circuit package

摘要

A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip. The heat-dissipating structure allows the integrated circuit chip to be prevented from being damaged by the thermal compressive stress from the encapsulant and the tensile stress from the silver paste for adhering the integrated circuit chip to a substrate on which the integrated circuit chip is mounted, thus allowing the integrated circuit package to be made more reliable with good yield rate.