发明名称 RESIN BOND TYPE GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To provide a resin bond type grinding wheel capable of suppressing emission of frictional heat by decreasing the grinding resistance and enhancing the anti-abrasiveness of the abrasive layer. SOLUTION: The abrasive layer 11 of resin bond type grinding wheel 10 is composed of a resin coupling phase 14 consisting of a thermosetting resin, for example a phenol resin, and super-abrasive grains 15 of diamond (or CBN, etc.), arranged dispresively in the resin coupling phase 14. A wear resistant filler 16, for example consisting of SiC, as a hard filler, hollow glass 17, and amorphous carbon 19 having a metal-covered layer 18 are installed dispersively in the resin coupling phase 14. The morphous carbon 19 is shaped spherical and furnished on its outer surface with metal-covered layer 18 consisting of a metal having a high terminal conductivity, for example Cu.
申请公布号 JP2001138244(A) 申请公布日期 2001.05.22
申请号 JP20000038653 申请日期 2000.02.16
申请人 MITSUBISHI MATERIALS CORP 发明人 TAKAHASHI TSUTOMU;TAKANO TOSHIYUKI;NAKAMURA MASATO
分类号 B24D3/02;B24D3/00;B24D3/28;B24D3/34;(IPC1-7):B24D3/02 主分类号 B24D3/02
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