发明名称 THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive silicone rubber composition having good handling characteristics and moldability even when a large amount of a thermally conductive filler is incorporated to obtain a silicon rubber having high thermal conductivity. SOLUTION: The thermally conductive silicone rubber composition comprises at least (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler, and the surface of the component (C) having been treated with (D) an oligosiloxane represented by the formula: (R1O)aSi(OSiOR23)(4-a) (wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; and a is 1, 2 or 3) or an oligosiloxane represented by the formula (R1O)aR2(3-a)SiO[R22SiO]nSi(OSiR23)bR2(3-a), wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; a is an integer of 1-3; b is an integer of 1-3; and n is an integer of >=0.
申请公布号 JP2001139815(A) 申请公布日期 2001.05.22
申请号 JP19990324086 申请日期 1999.11.15
申请人 DOW CORNING TORAY SILICONE CO LTD 发明人 ENAMI HIROSHI;ONISHI MASAYUKI;OKAWA SUNAO;AMAKO MASAAKI
分类号 C08L83/04;C08G77/04;C08K3/00;C08K5/5419;C08K5/56;C08K9/06;(IPC1-7):C08L83/04 主分类号 C08L83/04
代理机构 代理人
主权项
地址