发明名称 |
THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive silicone rubber composition having good handling characteristics and moldability even when a large amount of a thermally conductive filler is incorporated to obtain a silicon rubber having high thermal conductivity. SOLUTION: The thermally conductive silicone rubber composition comprises at least (A) a curable organopolysiloxane, (B) a curing agent, and (C) a thermally conductive filler, and the surface of the component (C) having been treated with (D) an oligosiloxane represented by the formula: (R1O)aSi(OSiOR23)(4-a) (wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; and a is 1, 2 or 3) or an oligosiloxane represented by the formula (R1O)aR2(3-a)SiO[R22SiO]nSi(OSiR23)bR2(3-a), wherein R1 is an alkyl group; R2 is the same or different aliphatic unsaturated bond-free monovalent hydrocarbon group; a is an integer of 1-3; b is an integer of 1-3; and n is an integer of >=0. |
申请公布号 |
JP2001139815(A) |
申请公布日期 |
2001.05.22 |
申请号 |
JP19990324086 |
申请日期 |
1999.11.15 |
申请人 |
DOW CORNING TORAY SILICONE CO LTD |
发明人 |
ENAMI HIROSHI;ONISHI MASAYUKI;OKAWA SUNAO;AMAKO MASAAKI |
分类号 |
C08L83/04;C08G77/04;C08K3/00;C08K5/5419;C08K5/56;C08K9/06;(IPC1-7):C08L83/04 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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