发明名称 METHOD AND APPARATUS FOR MANUFACTURING INORGANIC CURABLE MATERIAL, AND MOLD
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an inorganic curable material, and a mold not generating crack due to a strain generated at the material even by filling a panel base material made of an inorganic curable composition in the mold and thermally curing the material. SOLUTION: The mold A comprises a surface mold 1 made of an iron plate having a thickness of 20 mm, and a form 2a made of an iron provided at the peripheral edge of the mold 1 in such a manner that a cover 3 made of an iron plate having a thickness of 20 mm is mounted on the form 2a. A side plate 21a is provided at the inside of the form 2a. A panel base material 4 made of an inorganic curable composition is filled in the mold A.
申请公布号 JP2001138314(A) 申请公布日期 2001.05.22
申请号 JP19990319805 申请日期 1999.11.10
申请人 SEKISUI CHEM CO LTD 发明人 TAKIHANA HIROYUKI
分类号 C04B28/26;B28B7/34;B28B11/24;(IPC1-7):B28B7/34 主分类号 C04B28/26
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