发明名称 BONDING DEVICE AND METHOD FOR BOOKBINDING MATERIAL AND BOOK COVER IN BOOKBINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable a hot melt adhesive to be separated and cut the consumption of the hot melt adhesive to reduce a bookbinding cost when the bookbinding material is recycled. SOLUTION: The method for bonding a bookbinding material and a book cover A together in a bookbinding device is characterized in that it includes a first process to apply a PUR hot melt adhesive to the face (a) opposite to a spine face of the book cover A as a coating procedure and a second process to press the spine face of the bookbinding material to the face (a), opposite to the spine face of the book cover A, where the PUR hot melt adhesive is applied as a coating procedure. In addition, the bonding device for bonding the bookbinding material and the book cover A in the bookbinding device is characterized in that a bookbinding line for conveying the book cover A in a transfer direction which is the up-and-down direction of the book cover A, is provided and a coater head is mounted above the bookbinding line by positioning an adhesive hole on the face (a) opposite to the spine face of the book cover A in the process or transfer. Besides, an adhesive supply device which freely supplies the PUR hot melt adhesive into the adhesive hole of the coater head intermittently, is connected to the coater head, and the PUR hot melt adhesive is applied to the face (a) opposite to the spine face of the book cover A.
申请公布号 JP2001138664(A) 申请公布日期 2001.05.22
申请号 JP19990363210 申请日期 1999.11.15
申请人 SUNTOOL CORP 发明人 HIDAKA SHOJI
分类号 B42C11/04;(IPC1-7):B42C11/04 主分类号 B42C11/04
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