| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding wheel for polishing an irregular surface of a diamond film as high-rigidity fragile material precipitated on a wafer substrate using a mechanical polishing method, with such a low load that the diamond film is not peeled from the substrate, at high quality without generating defects in the surface, at high speed, and uniformly along the whole substrate surface, and a method thereof. SOLUTION: In this grinding wheel in which diamond abrasive grains 1 are coupled by polyimide-based or polyamidoimide-based resin bond 2, the diamond abrasive grains 1 of irregular form are used in which a flat range having a length of at least 1/4 or more of an average diameter from the surface of the polyimide-based or polyamidoimide-based resin bond 2 to the tip of the diamond abrasive grain exists, in which a tip position of the diamond abrasive grain 1 is within a range of 0.5μm for each abrasive grain 1, and in which a recessed dent of not less than 1/20 of an individual volume of the diamond abrasive grain is included by 10% or more of the individual volume.
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