CURABLE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a new curable composition good in adhesiveness and comprising a reactive silicon group-containing polyether oligomer improved in storage stability, an amino group-containing alkoxysilane compound and an epoxy group-containing alkoxysilane compound. SOLUTION: This curing composition comprises (A) the reactive silicon group- containing polyether oligomer having a structural unit represented by the general formula (1) : -O-R1-CH(CH3)-CH2-[Si(R22-b)(Xb)O]mSi(R33-a)Xa in the molecule, (B) the amino group-containing alkoxysilane compound and (C) the epoxy group- containing alkoxysilane compound.