发明名称 METHOD AND DEVICE FOR CONTROLLING LASER BEAM CUTTING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and a device for controlling laser beam cutting by which cutting condition is monitored and detected by a monitor during machining and simultaneously machining conditions can be automatically changed to those capable of obtaining improved cutting. SOLUTION: The control method is provided in such a way that the monitor 23 detects the color and jetting angle of the light of spatters SP generating in a machining zone in laser beam cutting, the a comparison is made between the machining condition data of the detected cutting state and the data 30 of the improved cutting state, and that the cutting conditions can be automatically changed so that the color and the jetting angle of the spattering light always exhibit those of the improved cutting. A numerically-controlled(NC) laser beam machining device 1 is provided with a cutting condition monitoring device which detects the color of the spatter and plasma generating at a machining zone and detects the state of the machining zone, and a comparing means which compares, with judgment, the machining condition data of the cutting state detected by the monitor and those of the improved cutting registered in the storage unit of the NC device, so that the cutting conditions are automatically changed so that each detected state constantly becomes the improved cutting state.</p>
申请公布号 JP2001138082(A) 申请公布日期 2001.05.22
申请号 JP19990315979 申请日期 1999.11.05
申请人 AMADA CO LTD 发明人 NAKAMURA ATSUSHI;SAKO HIROSHI
分类号 B23K26/00;B23K26/02;B23K26/03;B23K26/38;G01J3/46;(IPC1-7):B23K26/00 主分类号 B23K26/00
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