| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cerium abrasive agent which is small in sedimentation, easy in uniformity by stirring, and capable of grinding a surface to be ground of a silicon oxide insulating film at a high grinding speed without any damages while keeping the high flatness, and a board grinding method which is excellent in workability, and capable of grinding the surface to be ground of the silicon oxide insulating film at a high grinding speed without any damages while keeping the high flatness. SOLUTION: The cerium oxide abrasive agent contains cerium oxide particles, and consists of the slurry of 1μm/s in maximum sedimentation velocity, and the predetermined board is ground using this cerium oxide abrasive agent.</p> |
