摘要 |
PROBLEM TO BE SOLVED: To provide a small scaled desk type reflow soldering device with which the same profile as a large reflow soldering apparatus can be obtained with one set of heater for heating and the specification condition is satisfied. SOLUTION: In a reflow soldering device A having a work W carried by a carrier device 5 into the device body 1 and a heater 2 for heating the work W and executing soldering to electronic parts by heating the work W by the heater W for heating, the above heater 2 for heating and the above work W are set so as to be approachable, the preheating and the main heating are performed with the above heater 2 for heating.
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