发明名称 REFLOW SOLDERING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a small scaled desk type reflow soldering device with which the same profile as a large reflow soldering apparatus can be obtained with one set of heater for heating and the specification condition is satisfied. SOLUTION: In a reflow soldering device A having a work W carried by a carrier device 5 into the device body 1 and a heater 2 for heating the work W and executing soldering to electronic parts by heating the work W by the heater W for heating, the above heater 2 for heating and the above work W are set so as to be approachable, the preheating and the main heating are performed with the above heater 2 for heating.
申请公布号 JP2001138040(A) 申请公布日期 2001.05.22
申请号 JP19990352175 申请日期 1999.11.05
申请人 OKUHARA ELECTRIC INC 发明人 OKUHARA CHIYOSHI
分类号 B23K1/008;B23K1/00;B23K31/02;H05K3/34;(IPC1-7):B23K1/008 主分类号 B23K1/008
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