发明名称 Adhesive silicone sheet, method for the preparation thereof and semiconductor devices
摘要 An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.
申请公布号 US6235862(B1) 申请公布日期 2001.05.22
申请号 US19980070078 申请日期 1998.04.30
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 ISSHIKI MINORU;MINE KATSUTOSHI;OTANI YOSHIKO;YAMAKAWA KIMIO
分类号 C09J7/00;C09J7/02;C09J183/04;C09J183/05;C09J183/07;H01L21/52;H01L21/58;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 主分类号 C09J7/00
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