发明名称 CURABLE PRESSURE SENSITIVE ADHESIVE TAPE FOR ADHERING ABS RESIN PLATE
摘要 PROBLEM TO BE SOLVED: To provide a curable pressure sensitive adhesive tape for adhering an ABS resin plate, having an excellent stickiness and initial adhesive power at normal temperature before hardening, excellent in workability and handleability because the adhesive is almost free from flash and leak out, curable by irradiation with a light before or after laminating to a substrate, and exhibiting an excellent adhesivity, heat resistance, impact resistance, or the like, after curing. SOLUTION: The curable pressure sensitive adhesive tape for adhering ABS resin plate comprises a curable pressure sensitive adhesive composition laminated on a side of a base material while the pressure sensitive adhesive comprises a thermoplastic resin, a compound capable of carrying out a cationic polymerization and a photo cationic polymerization initiator in the composition, where the ratio of the molar concentration of cations generated by the photo cationic polymerization initiator to that of an acrylonitrile component included in the ABS resin plate (a substrate) is 0.3-5%.
申请公布号 JP2001139901(A) 申请公布日期 2001.05.22
申请号 JP19990319809 申请日期 1999.11.10
申请人 SEKISUI CHEM CO LTD 发明人 MIURA MAKOTO;ISHIZAWA HIDEAKI
分类号 C09J7/02;C09J163/00;C09J167/00;C09J175/04;(IPC1-7):C09J7/02 主分类号 C09J7/02
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