发明名称 |
CHEMICAL MECHANICAL POLISHING APPARATUS WITH IMPROVED SUBSTRATE CARRIER HEAD AND METHOD OF USE |
摘要 |
<p>An improved and new substrate carrier head for use in a CMP apparatus is described. The new substrate carrier head has a substrate retaining ring with embedded intersecting channels in the outer face. The embedded intersecting channels improve the circulation of polishing slurry to and from the polished substrate and polishing byproducts away from the polished substrate and thereby improve the polishing uniformity on the substrate.</p> |
申请公布号 |
SG80624(A1) |
申请公布日期 |
2001.05.22 |
申请号 |
SG19990001967 |
申请日期 |
1999.04.27 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD |
发明人 |
QUEK SER WEE SEBASTIAN;CHARLES LIN;JIMMY LO YUK TING |
分类号 |
B24B37/32;(IPC1-7):H01L20/00 |
主分类号 |
B24B37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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