发明名称 DIAMOND FILM GRINDING WHEEL, AND ITS GRINDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a grinding wheel and a grinding method to uniformly grind a whole surface of a substrate of high quality at a high speed without generating any defects on the surface at a load as low as to prevent a film from being peeled from the substrate using a mechanical grinding method for uneven surfaces of a diamond film. SOLUTION: The protrusion of abrasive grains is <=1/5 of the mean diameter of the abrasive grains using monolithic abrasive grains of high unevenness, and the diamond is ground using a grinding wheel using a vitrified bond as a bond material. The coefficient of friction between the grinding wheel and the diamond surface is reduced continuously or step by step. The coefficient of friction is changed according to the protrusion of the abrasive grains, the humidity of the grinding atmosphere, or the presence/absence of scattering of a grinding agent.
申请公布号 JP2001138232(A) 申请公布日期 2001.05.22
申请号 JP19990319014 申请日期 1999.11.10
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SEKI YUICHIRO;ISHIBASHI KEIJI;FUJII SATORU;SHIKADA SHINICHI
分类号 B24B7/22;B24B19/22;B24B53/00;B24D3/00;B24D3/02;B24D3/14;H01L21/304;(IPC1-7):B24B53/00 主分类号 B24B7/22
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