| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat-resistant bonding sheet which excels in heat resistance to soldering, adhesion, dimensional stability, and low dielectric characteristics while possessing sufficient mechanical strength. SOLUTION: The method of manufacturing a heat-resistant bonding sheet which comprises a step of producing a partially imidated gel film of an amic acid of the precursor of (a) a polyaimide, a step of coating an organic solvent solution of an amic acid of the precursor of (b) a thermoplastic polyimide on the surface of the gel film, a step of subsequently converting the gel film and the coated thermoplastic film to the polyimide (a) and the thermoplastic polyimide (b), respectively, and a step of drying the resulting films in the process of producing a laminate constituted by laminating the thermoplastic polyimde (b) layer on one side or both sides of the polyimide (a) film can realize particularly high adhesion of the interface between the base film and the thermoplastic polyimide. The heat-resistant bonding sheet also excels in heat resistance, heat resistance to soldering and dimension stability. This heat-resistant bonding sheet can be used particularly for flexible copper-clad laminates.
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