| 摘要 |
PROBLEM TO BE SOLVED: To increase the productivity (throughput) of plating by automation to improve the advantage of a dip system and to provide the fully automated plating device and plating method by which the quality is improved, the footprint of the device is saved, the cooperation with the preceding stage, etc., are attained. SOLUTION: An anode plate 25 is suspended in a plating tank 1, an article 4 to be plated is hung down in opposition to the anode plate, a circular opening 3 is provided to the side face of the tank, a substrate stage 5 pressed to close the opening, separated from the opening and holding the article in vacuum is furnished, an air cylinder 35 is provided to close the opening and to separate the stage from the opening, and the article is positioned within the tank, brought into contact with a plating solution in the tank and plated.
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