发明名称 Process for forming a crown shaped capacitor structure for a DRAM device
摘要 A process for forming crown shaped capacitor structures, for a DRAM device, has been developed. The process features the use of a disposable insulator layer, applied prior to photolithographic and dry etching procedures, used to define the capacitor upper plate structures. The disposable insulator layer alleviates the topography effects presented by crown shaped storage node structures, relaxing the complexity of the patterning of the capacitor upper plate structures.
申请公布号 US6235580(B1) 申请公布日期 2001.05.22
申请号 US19990467123 申请日期 1999.12.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 LEE YU-HUA;WU CHENG-MING;CHIANG WEN-CHUAN
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/02
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