| 摘要 |
A printed circuit board with at least one cavity produced by combining a dielectric core layer with an adhesive layer. The adhesive layer is a no-flow bond film without a corresponding window. Thus the bond film also act as the base of the cavity. According to one feature of the invention, a top core layer having a window is laid on top of the bond film. Since the bond film does not have a window, the tedious step of registering different windows is completely eliminated. According to a further feature of the invention, the thickness of the top core layer from where the cavity will be derived is adjusted to thicker than or the same as the depth of the cavity in the final printed circuit board. |
